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Customize various semiconductor carrier tapes

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Customize various semiconductor carrier tapes

Carrier tape can be divided into embossed carrier tape and punch carrier tape according to the forming process. The embossed carrier tape refers to the process of using molds or vacuum forming to locally stretch the carrier tape material, forming a concave shaped cavity. This type of carrier can form cavities of different sizes according to specific needs to accommodate the cross-sectional area of the electronic components it contains. Stamping carrier tape refers to the formation of a penetrating or semi penetrating cavity through die cutting. The thickness of electronic components that can be contained in this carrier tape is limited by the thickness of the carrier tape itself and can generally only be used for packaging smaller components. Our carrier tapes include PS carrier tape, PC carrier tape, and ABS transparent carrier tape. We also offer SMT carrier tape, Custom Carrier tape, Cover tape, High Capability Carrier tape, and ESD carrier tape. If necessary, please send us the pod…