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Aluminum Nitride Ceramic AMB Copper-clad Substrate

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Aluminum Nitride Ceramic AMB Copper-clad Substrate

Aluminum Nitride Ceramic AMB Copper-clad Substrate Puwei's Aluminum Nitride Ceramic AMB Copper-clad Substrate represents the forefront of thermal management for extreme power electronics. Engineered using Active Metal Brazing (AMB) technology, it bonds high-purity AlN ceramic with oxygen-free copper. This creates a superior platform for advanced Electronic Packaging and next-generation Microelectronics Packaging solutions. Core Advantages Extreme Thermal Conductivity: 170-200 W/m·K, 5-10x higher than Al₂O₃, making it an ideal high thermal conductivity ceramic substrate. Unmatched Bond Strength: >70 MPa peel strength ensures reliability in harsh conditions. Superior Thermal Cycling: Withstands over 5,000 cycles (-55°C to 150°C). Optimized CTE Match: Closely matches silicon and SiC, reducing stress in high-power microelectronic components. Technical Specifications Precision-engineered parameters for demanding power applications, including IGBT ceramic substrates and high…