Aluminum Nitride Ceramic AMB Copper-clad Substrate
Aluminum Nitride Ceramic AMB Copper-clad Substrate Product Overview Puwei Ceramic's Aluminum Nitride Ceramic AMB Copper-clad Substrate represents a breakthrough in high-performance electronic packaging solutions. Designed for extreme environments, this substrate leverages the exceptional thermal conductivity of Aluminum Nitride (AlN) – significantly higher than traditional materials like aluminum oxide and silicon nitride. It efficiently dissipates heat in high-power, high-current applications, ensuring reliability and longevity. The Active Metal Brazing (AMB) technology employed creates a robust bond between the ceramic and copper layers, offering superior resistance to thermal and mechanical stress. As a leader in advanced ceramics, Puwei Ceramic also produces related products like Alumina Ceramic Substrates and DBC Ceramic Substrates, providing a comprehensive range of solutions for the electronics industry. Our AMB AlN substrates are ideal for demanding sectors such as electric…
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